Production Hiccup Delays Launch of AMD Ryzen 9000 Series; Unexpected Ryzen 7 Chip Surfaces, Impacts Ryzen 5 9600X Availability
The Aftermath of Zen 5’S Initial Ryzen 9000 Die Failure - A Deep Dive Into Cracked Dice & Residual Solder Evidence
Content creator and extreme overclockerTony Yu had the rare privilege of being one of (if not the) first people to delid one of AMD’s brand newRyzen 9000 processors, which will contend with thebest CPUs . Sadly, the content creator revealed photos of his delidding attempt failing, resulting in a cracked and broken Zen 5 CPU.
TheZen 5 chip can be seen with the IHS removed from the CPU. The exposed die shot reveals the unsuccessful delid, revealing a cracked I/O die on the Ryzen chip and an unclean break on the IHS, with material still mated to the soldering points that shouldn’t be where the I/O die would be located.
Yu’s unsuccessful attempt shows how dangerous delidding can be. Delidding is a term that specifies removing the integrated heat spreader off of a semiconductor chip, exposing the physical die underneath. Delidding difficulty depends significantly on the specific CPU model and whether or not the die is soldered to the IHS. If the CPU utilizes thermal paste between the die and the IHS, it is generally easier to remove the IHS. If the chip is soldered, excellent care and work must be executed to ensure the chip survives the delidding process.
Delidding is done primarily by overclockers, enthusiasts, and extreme overclockers to boost cooling performance. Removing the IHS enables users to access the CPU die directly, allowing them to cool the chip directly from the die. Attaching a cooler directly to the die is more energy efficient. Generally, it results in lower temperatures than transferring the heat through the IHS and directly to the CPU cooler.
LATEST VIDEOS FROM tomshardware Tom’s Hardware
There may not be much reason to delid a Ryzen 9000 CPU since AMD uses solder to install the IHS on Ryzen 9000, which yields better thermal conductivity than thermal paste — which Intel is typically known for doing. So, for regular usage, users shouldn’t gain significant temperature improvements from delidding AMD’s latest processors specifically.
Regardless, it is cool to see what the CPU looks like underneath. Yu is also an extreme overclocker, so there’s a good chance he delidded the chip for extreme overclocking.
Ryzen 9000 is AMD’s latest generation of processors based on the Zen 5 CPU architecture. Reviews for The Ryzen 5 9600X and Ryzen 7 9700X went live earlier this morning. Both chips will be available starting tomorrow. Meanwhile, AMD’s higher-end Ryzen 9 9950X and 9900X will go on sale next Thursday, August 15.
Stay On the Cutting Edge: Get the Tom’s Hardware Newsletter
Get Tom’s Hardware’s best news and in-depth reviews, straight to your inbox.
Contact me with news and offers from other Future brands Receive email from us on behalf of our trusted partners or sponsors
By submitting your information you agree to theTerms & Conditions andPrivacy Policy and are aged 16 or over.
Also read:
- [New] 2024 Approved The New Wave on YouTube & FB Discover the Hottest 8 Trends
- [Updated] 2024 Approved Browsing Made Memorable The Leading Screen Recorder Software
- [Updated] 2024 Approved Maximize Visual & Auditory Impact in Windows 10 Photos App
- [Updated] Expertly Curated 9 Best Video Conferencing Software for Smartphones & Tablets
- Act Fast to Secure a $200 Savings on the New M1 MacBook Air | Shop Now with ZDNET Exclusive Offers!
- Disabling Microsoft Defender Antivirus in Windows 11: A Step-by-Step Guide
- Discover How You Can Get a Whopping $300 Discount on the Asus VivoBook Pro at Amazon Today – Spotted by Tech Experts at ZDNet!
- Exploring the Key Discoveries at CES 2023 Day Two: A Comprehensive Review
- Fencing Leagues Withdraw Online Presence
- HP's Ultimate Tech Savings Event: Unbeatable Deals on Monitors & Laptops with Up to 71% Discounts
- In 2024, Innovative Uses of B-Roll Beyond Traditional Applications
- Methods to Clear Up OBS Fullscreen Troubles
- Next-Gen Computing Solutions: How Lenovo's New ThinkPad Series with Advanced AI Features Is Redefining Work Laptops | Expert Analysis by ZDNET
- Prime Day Sale Bargains at Best Buy - Top Picks From the October 2024 Event You Can't Miss!
- Score the Top-Notch Meta VR Offer with 512GB Quest Headset This October, Exclusive Deal Alert
- Super Easy Ways To Deal with Oppo Reno 8T 5G Unresponsive Screen | Dr.fone
- Top Prime Day Bargains: Best Video Game Offers Available in October 2024 - Insights From ZDNet
- Unleash Power Play: Land a Jaw-Dropping Savings of More Than $650 on This Top-Tier Acer Laptop for Gamers at Newegg Exclusive
- Upcoming Redesign: Apple Set to Update Budget-Friendly Series SE Timepiece - Exciting Features Revealed
- Title: Production Hiccup Delays Launch of AMD Ryzen 9000 Series; Unexpected Ryzen 7 Chip Surfaces, Impacts Ryzen 5 9600X Availability
- Author: Richard
- Created at : 2024-10-26 19:41:11
- Updated at : 2024-11-01 18:27:26
- Link: https://hardware-updates.techidaily.com/production-hiccup-delays-launch-of-amd-ryzen-9000-series-unexpected-ryzen-7-chip-surfaces-impacts-ryzen-5-9600x-availability/
- License: This work is licensed under CC BY-NC-SA 4.0.